Diamond

Diamond series lasers

Applications:Industrial Manufacturing, Superhard Materials

The Diamond series solid state lasers are specially designed for cutting, drilling, etching and other precision machining needs of carbon and ultra-hard materials such as diamond, SiC, carbon fiber and so on. They solve the problem that traditional fibre lasers and solid state lasers are difficult to achieve an etching depth of more than 3mm on ultra-hard materials due to their low energy.

Diamond series lasers have high single pulse energy, which makes it able to etch and process deeper on super-hard materials, breaking through the limitations of traditional lasers that can only be processed to a certain depth and then can not continue to extend downwards. This greater processing capability makes it more efficient in processing ultra-hard materials.

In addition, Diamond series lasers also provide a variety of pulse width options, which provides a variety of possible process options for the processing of ultra-hard materials, and can be flexibly selected and adjusted according to different material characteristics and processing needs, further improving processing efficiency and quality.

Products

ProductModelApplicationPulse Width (ns)Average Power (W)Single Pulse Energy (uJ)Repitition Rate

Diamond 532nm laser

1064nm

MMEPG-1064-18-HE-D20Drilling in brittle materials、Carbon material cutting、 Laser trimming<20ns@10kHz>18W@10kHz~1800uJ@10kHz7kHz-100kHz
MMEPA-1064-25-HE-D20>25W@10kHz~2500uJ@10KHZ
MMEPG-1064-18-HE-D70>70ns@10kHz>18W@10kHz~1800uJ@10kHz7kHz-100kHZ
MMEPA-1064-25-HE-D70>25W@10kHz~2500uJ@10KHZ
MMD-YAG-1064-1Gem planning
Diamond marking
~12ns@12kHz>1W@12kHz~30uJ@12kHz~12kHz

532nm

MMEPG-532-16-HE-D20Diamond slicing&coring
Diamond shape cutting(4 Processing for 4mm+ diamonds)
Carbon fiber cutting
Sic wafer dicing
Super hard material cutting
<20ns@10kHz>16W@10kHz~1600uJ@10kHz7kHz-100kHZ
MMEPG-532-20-HE-D20>20W@10kHz~2000uJ@10kHz
MMEPG-532-16-HE-D70>70ns@10kHz>16W@10kHz~1600uJ@10kHz7kHz-100kHZ
MMEPG-532-20-HE-D70>20W@10kHz~2000uJ@10kHz

355nm

MMEPU-355-10-HEDiamond cutting – slicing and coring, Super hard material cutting – PcBN、
PCD、SCD and CVD diamond、SiC、 etc.
<20ns@10kHz>10W@10kHz~1000uJ@10kHz10kHz-100kHZ